Hanwha Semitech Unveils Next‑Gen Packaging Equipment at SEMICON Taiwan 2026
Creatrip Team
19 days ago
Hanwha Semitech is showcasing four advanced semiconductor packaging machines at SEMICON Taiwan 2026 in Taipei (Feb 2–4). The debut of the SFM5 Square — a large‑area FOPLP (panel‑level packaging) tool for 600×600 mm square panels — aims to reduce waste and improve throughput versus traditional round wafers. Other highlights include the SFM5 Xpert 3D TC bonder, the SFM5 TnR 2.5D CoW bonder, and the SHB2 Nano hybrid bonder. The SHB2 Nano’s direct bonding of copper electrodes to insulators enables thinner, denser chip stacks and is positioned as a key tool for next‑generation HBM (high‑bandwidth memory) and AI semiconductor production. Hanwha Semitech plans to use the exhibition to expand collaborations with global chipmakers and accelerate entry into the FOPLP and next‑gen packaging markets.
